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| HD74AC74 Dual D-Type Positive Edge-Triggered Flip-Flop Description The HD74AC74 is a dual D-type flip-flop with Asynchronous Clear and Set inputs and complementary (Q, Q) outputs. Information at the input is transferred to the outputs on the positive edge of the clock pulse. Clock triggering occurs at a voltage level of the clock pulse and is not directly related to the transition time of the positive-going pulse. After the Clock Pulse input threshold voltage has been passed, the Data input is locked out and information present will not be transferred to the outputs until the next rising edge of the Clock Pulse input. Features Asynchronous Inputs: Low input to SD (Set) sets Q to High level Low input to CD (Clear) sets Q to Low level Clear and Set are independent of clock Simultaneous Low on CD and SD makes both Q and Q High * Outputs Source/Sink 24 mA HD74AC74 Pin Arrangement CD1 1 D1 2 CP1 3 SD1 4 Q1 5 Q1 6 GND 7 (Top view) D2 CD2 CP2 SD2 CP1 D1 SD1 CD1 14 VCC 13 CD2 12 D2 11 CP2 10 SD2 9 Q2 8 Q2 Q 1 Q1 Q 2 Q2 Logic Symbol SD1 D1 CP1 Q1 Q1 D2 SD2 Q2 CP2 Q2 CD1 CD2 Pin Names D1, D2 CP1, CP2 C D1, CD2 S D1, SD2 Q1, Q1, Q2, Q 2 Data Inputs Clock Pulse Inputs Direct Clear Inputs Direct Set Inputs Outputs 2 HD74AC74 Truth Table (Each Half) Inputs SD L H L H H H H L X : : : : Q0 (Q0) : CD H L L H H H High Voltage Level Low Voltage Level Immaterial Low-to-High Clock Transition Previous Q (Q) before Low-to-High Transition of Clock L CP X X X D X X X H L X Outputs Q H L H H L Q0 Q L H H L H Q0 Logic Diagram SD D CP Q Q CD Please note that this diagram is provised only for the understanding of logic operations and should not be used to estimate propagation delays. DC Characteristics (unless otherwise specified) Item Maximum quiescent supply current Maximum quiescent supply current Symbol I CC I CC Max 40 4.0 Unit A A Condition VIN = VCC or ground, VCC = 5.5 V, Ta = Worst case VIN = VCC or ground, VCC = 5.5 V, Ta = 25C 3 HD74AC74 AC Characteristics Ta = +25C CL = 50 pF Item Maximum clock frequency Propagation delay CDn or SDn to Qn or Qn Propagation delay CDn or SDn to Qn or Qn Propagation delay CP n to Q n or Qn Propagation delay CP n to Q n or Qn Note: t PHL t PLH t PHL t PLH Symbol f max VCC (V)*1 3.3 5.0 3.3 5.0 3.3 5.0 3.3 5.0 3.3 5.0 Min 100 140 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 Typ 125 160 8.0 6.0 10.5 8.0 8.0 6.0 8.0 6.0 Max -- -- 12.0 9.0 12.0 9.5 13.5 10.0 14.0 10.0 Ta = -40C to +85C CL = 50 pF Min 95 125 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 Max -- -- 13.0 10.0 13.5 10.5 16.0 10.5 14.5 10.5 ns ns ns ns Unit MHz 1. Voltage Range 3.3 is 3.3 V 0.3 V Voltage Range 5.0 is 5.0 V 0.5 V AC Operating Requirements: HD74AC74 Ta = +25C CL = 50 pF Item Set-up time, HIGH or LOW Dn to CPn Hold time, HIGH or LOW Dn to CPn CP n or CDn or SDn Pulse width Recovery time CDn or SDn to CP Note: t rec tw th Symbol t su VCC (V)*1 Typ 3.3 5.0 3.3 5.0 3.3 5.0 3.3 5.0 1.5 1.0 -2.0 -1.5 3.0 2.5 -2.5 -2.0 Ta = -40C to +85C CL = 50 pF Guaranteed Minimum 4.0 3.0 0 0 5.5 4.5 0 0 4.5 3.0 0 0 7.0 5.0 0 0 ns ns ns Unit ns 1. Voltage Range 3.3 is 3.3 V 0.3 V Voltage Range 5.0 is 5.0 V 0.5 V 4 HD74AC74 Capacitance Item Input capacitance Power dissipation capacitance Symbol CIN CPD Typ 4.5 35.0 Unit pF pF Condition VCC = 5.5 V VCC = 5.0 V 5 Unit: mm 19.20 20.32 Max 14 8 6.30 7.40 Max 1 2.39 Max 1.30 7 7.62 0.51 Min 2.54 Min 5.06 Max 2.54 0.25 0.48 0.10 0.25 - 0.05 0 - 15 + 0.10 Hitachi Code JEDEC EIAJ Weight (reference value) DP-14 Conforms Conforms 0.97 g Unit: mm 10.06 10.5 Max 14 8 5.5 1 7 *0.22 0.05 0.20 0.04 2.20 Max 7.80 - 0.30 1.15 0 - 8 0.70 0.20 + 0.20 1.42 Max 1.27 *0.42 0.08 0.40 0.06 0.12 M Hitachi Code JEDEC EIAJ Weight (reference value) FP-14DA -- Conforms 0.23 g *Dimension including the plating thickness Base material dimension 0.10 0.10 0.15 Unit: mm 8.65 9.05 Max 14 8 3.95 1 1.75 Max 7 *0.20 0.05 6.10 - 0.30 1.08 + 0.10 0.635 Max 0 - 8 0.11 0.14 + 0.04 - 1.27 *0.40 0.06 0.67 0.60 + 0.20 - 0.15 0.25 M Hitachi Code JEDEC EIAJ Weight (reference value) FP-14DN Conforms Conforms 0.13 g *Pd plating Unit: mm 5.00 5.30 Max 14 8 4.40 1 *0.22+0.08 -0.07 7 0.65 1.0 0.13 M 0.83 Max *0.17 0.05 0.15 0.04 1.10 Max 6.40 0.20 0 - 8 0.50 0.10 0.20 0.06 0.10 0.07 +0.03 -0.04 *Dimension including the plating thickness Base material dimension Hitachi Code JEDEC EIAJ Weight (reference value) TTP-14D -- -- 0.05 g Cautions 1. Hitachi neither warrants nor grants licenses of any rights of Hitachi's or any third party's patent, copyright, trademark, or other intellectual property rights for information contained in this document. Hitachi bears no responsibility for problems that may arise with third party's rights, including intellectual property rights, in connection with use of the information contained in this document. 2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use. 3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However, contact Hitachi's sales office before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support. 4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as failsafes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other consequential damage due to operation of the Hitachi product. 5. This product is not designed to be radiation resistant. 6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Hitachi. 7. Contact Hitachi's sales office for any questions regarding this document or Hitachi semiconductor products. Hitachi, Ltd. Semiconductor & Integrated Circuits. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan Tel: Tokyo (03) 3270-2111 Fax: (03) 3270-5109 URL NorthAmerica : http:semiconductor.hitachi.com/ Europe : http://www.hitachi-eu.com/hel/ecg Asia (Singapore) : http://www.has.hitachi.com.sg/grp3/sicd/index.htm Asia (Taiwan) : http://www.hitachi.com.tw/E/Product/SICD_Frame.htm Asia (HongKong) : http://www.hitachi.com.hk/eng/bo/grp3/index.htm Japan : http://www.hitachi.co.jp/Sicd/indx.htm For further information write to: Hitachi Semiconductor (America) Inc. 179 East Tasman Drive, San Jose,CA 95134 Tel: <1> (408) 433-1990 Fax: <1>(408) 433-0223 Hitachi Europe GmbH Electronic components Group Dornacher Strae 3 D-85622 Feldkirchen, Munich Germany Tel: <49> (89) 9 9180-0 Fax: <49> (89) 9 29 30 00 Hitachi Europe Ltd. Electronic Components Group. Whitebrook Park Lower Cookham Road Maidenhead Berkshire SL6 8YA, United Kingdom Tel: <44> (1628) 585000 Fax: <44> (1628) 778322 Hitachi Asia Pte. Ltd. 16 Collyer Quay #20-00 Hitachi Tower Singapore 049318 Tel: 535-2100 Fax: 535-1533 Hitachi Asia Ltd. Taipei Branch Office 3F, Hung Kuo Building. No.167, Tun-Hwa North Road, Taipei (105) Tel: <886> (2) 2718-3666 Fax: <886> (2) 2718-8180 Hitachi Asia (Hong Kong) Ltd. Group III (Electronic Components) 7/F., North Tower, World Finance Centre, Harbour City, Canton Road, Tsim Sha Tsui, Kowloon, Hong Kong Tel: <852> (2) 735 9218 Fax: <852> (2) 730 0281 Telex: 40815 HITEC HX Copyright ' Hitachi, Ltd., 1999. All rights reserved. Printed in Japan. |
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